Editorial Board

Editor-in-Chief

Prof. Dr.-Ing. Eduard Jorswieck
Univ.-Professor für Theoretische Nachrichtentechnik  
Technische Universität Dresden
Fakultät für Elektrotechnik und Informationstechnik 
Institut für Nachrichtentechnik
01062 Dresden
E-Mail: Eduard.Jorswieck@tu-dresden.de

Associate Editors

Farid Ahmed, Johns Hopkins University Applied Physics Laboratory, USA
M. Alam, Xi'an Jiaotong-Liverpool University, China
Giusi Alfano, DISAT Politecnico di Torino, Italy
Carles Antón-Haro, Telecommunications Technological Center of Catalonia (CTTC), Spain
Kamran Arshad, Ajman University, UAE
Yong Bai, Hainan University, China
Marco Baldi, Università Politecnica delle Marche, Italy
Vo Nguyen Quoc Bao, PTIT Posts and Telecommunications Institute of Technology, Vietnam
Tadilo Endeshaw Bogale, North Carolina A&T State University, USA
Pan Cao, The University of Edinburgh, United Kingdom
Yue Cao, Lancaster University, UK
Anas Chaaban, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi Arabia
Hong-bin Chen, Guilin University of Electronic Technology, China
Yuh Shyan Chen, National Taipei University, Taiwan
Pascal Chevalier, Thalès-Communications, France
Wen-Long Chin, National Cheng Kung University, Taiwan
Spyridon K. Chronopoulos, University of Ioannina, Greece
Daniel Benevides da Costa, Federal University of Ceara , Brazil
Ibrahim Develi, Erciyes University, Turkey
Arman Farhang, Maynooth University, Ireland
Michael Gastpar, University of California at Berkeley, USA
Zabih F. Ghassemlooy, Northumbria University, United Kingdom
Filippo Giannetti, Università di Pisa, Italy
Anastasios Giovanidis, Marie Curie University, France
Gerardo Gómez, ETSI Telecomunicación, Universidad de Málaga, Spain
Jean-marie Gorce, Institut National des Sciences Appliquées de Lyon, France
Sotirios K. Goudos, Aristotle University of Thessaloniki, Greece
Fabrizio Granelli, Università degli Studi di Trento, Italy
Francesco Grimaccia, POLITECNICO DI MILANO University, Italy
Emanuel Guariglia, University of Naples Federico II, Italy
Zehua Guo, University of Minnesota, Minneapolis, US
Shengqian Han, Beihang University, China
Chunlong He, Shenzhen University, China
Shiwen He, Central South University, China
Shagufta Henna, Waterford Institute of Technology, Ireland  
Yongming Huang, Southeast University, China
Yulin Hu, RWTH Aachen University, Germany
Min Jia, Harbin Institute of Technology, China
Jing Jiang, Durham University, UK
Mingye Ji, University of Utah, USA
Hamdi Joudeh, Imperial College London, UK
Md Jahidur Rahman, Qualcomm Inc., USA
Omprakash Kaiwartya, Nottingham Trent University, UK
Muhammad Ruhul Amin Khandaker, Heriot-Watt University, UK 
Thomas D. Lagkas, The University of Sheffield, Greece
Lukas Landau, Center of Telecommunication Studies at PUC-Rio, Brazil
Vincent Lau, Hong Kong University of Science and Technology, Hong Kong
Tho Le-Ngoc, McGill University, Canada
Feng Li, Zhejiang University of Technology, China
Chengchao Liang, Carleton University, Canada
Lingjia Liu, Virginia Tech, USA
Xin Liu, Dalian University of Technology, China
Daniel Lucani, Aalborg University, Denmark
Nicola Marchetti, Trinity College Dublin, Ireland
Roman Maršálek, Brno University of Technology, Czech Republic
Rami Mochaourab, KTH Royal Institute of Technology, Sweden
Nader Mokari, Tarbiat Modares University, Iran
Youssef Nasser, American University of Beirut, Lebanon
Duy H. N. Nguyen, San Diego State University, USA
Ngoc Tu Nguyen, Missouri University of Science and Technology, USA
Giovanni Pau, Kore University, Italy
Jordi Pérez-Romero, Universitat Politècnica de Catalunya (UPC), Spain
Mylène Pischella, Conservatoire National des Arts et Métiers, France
Bhaskar Prasad Rimal, The University of New Mexico, USA
Rukhsana Ruby, Shenzhen University, China
Panagiotis Sarigiannidis, University of Western Macedonia, Greece
Stefan Schwarz, Technische Universität Wien, Austria
Dimitrios Skoutas, University of the Aegean Karlovassi, Greece
Richard Demo Souza, Federal University of Santa Catarina (UFSC), Florianopolis, SC, Brazil
Zhi Sun, University of Buffalo, USA
Jie Tang, South China University of Technology, China
Stefano Tomasin, University of Padova, Italy
Le-Nam Tran, University College Dublin, Ireland
Miaowen Wen, South China University of Technology, China
Haijun Zhang, University of Science and Technology, China
Heng Zhang, Western Sydney University, Australia
Qi Zhang, Department of Engineering, Aarhus University, Denmark
Caijun Zhong, Zhejiang University, China
Huan Zhou, China Three Gorges University, China
Zhenyu Zhou, North China Electric Power University, China
Nizar Zorba, Qatar University, Qatar