Editorial Board

Editor-in-Chief

Prof. Dr.-Ing. Eduard Jorswieck
Univ.-Professor für Theoretische Nachrichtentechnik  
Technische Universität Dresden
Fakultät für Elektrotechnik und Informationstechnik 
Institut für Nachrichtentechnik
01062 Dresden
E-Mail: Eduard.Jorswieck@tu-dresden.de

Associate Editors

Farid Ahmed, Johns Hopkins University Applied Physics Laboratory, USA
Giusi Alfano, DISAT Politecnico di Torino, Italy
Carles Antón-Haro, Telecommunications Technological Center of Catalonia (CTTC), Spain
Kamran Arshad, Ajman University, UAE
Yong Bai, Hainan University, China
Marco Baldi, Università Politecnica delle Marche, Italy
Vo Nguyen Quoc Bao, PTIT Posts and Telecommunications Institute of Technology, Vietnam
Pan Cao, The University of Edinburgh, United Kingdom
Anas Chaaban, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi Arabia
Yuh Shyan Chen, National Taipei University, Taiwan
Pascal Chevalier, Thalès-Communications, France
Spyridon K. Chronopoulos, University of Ioannina, Greece
Daniel Benevides da Costa, Federal University of Ceara , Brazil
Rodrigo C. De Lamare, The University of York, United Kingdom
Ibrahim Develi, Erciyes University, Turkey
Qian Gao, University of Science and Technology of China, China
Michael Gastpar, University of California at Berkeley, USA
Zabih F. Ghassemlooy, Northumbria University, United Kingdom
Filippo Giannetti, Università di Pisa, Italy
Anastasios Giovanidis, Marie Curie University, France
Gerardo Gómez, ETSI Telecomunicación, Universidad de Málaga, Spain
Jean-marie Gorce, Institut National des Sciences Appliquées de Lyon, France
Fabrizio Granelli, Università degli Studi di Trento, Italy
Francesco Grimaccia, POLITECNICO DI MILANO University, Italy
Shengqian Han, Beihang University, China 
Yongming Huang, Southeast University, China
Min Jia, Harbin Institute of Technology, China
Jing Jiang, Durham University, UK
Mingye Ji, University of Utah, USA
David Jonietz, ETH Zürich, Switzerland
Hamdi Joudeh, Imperial College London, UK
Md Jahidur Rahman, Qualcomm Inc., USA
Muhammad Ruhul Amin Khandaker, University College London (UCL), United Kingdom 
Thomas D. Lagkas, The University of Sheffield, Greece
Vincent Lau, Hong Kong University of Science and Technology, Hong Kong
Tho Le-Ngoc, McGill University, Canada
Feng Li, Zhejiang University of Technology, China
Lingjia Liu, Virginia Tech, USA
Xin Liu, Dalian University of Technology, China
Daniel Lucani, Aalborg University, Denmark
Nicola Marchetti, Trinity College Dublin, Ireland
Roman Maršálek, Brno University of Technology, Czech Republic
Rami Mochaourab, KTH Royal Institute of Technology, Sweden
Youssef Nasser, American University of Beirut, Lebanon
Duy H. N. Nguyen, San Diego State University, USA
Ngoc Tu Nguyen, Missouri University of Science and Technology, USA
Claude Oestges, Université catholique de Louvain, Belgium
Giovanni Pau, Kore University, Italy
Jordi Pérez-Romero, Universitat Politècnica de Catalunya (UPC), Spain
Bhaskar Prasad Rimal, The University of New Mexico, USA
Stefan Schwarz, Technische Universität Wien, Austria
Dimitrios Skoutas, University of the Aegean Karlovassi, Greece
Richard Demo Souza, Federal University of Santa Catarina (UFSC), Florianopolis, SC, Brazil
Zhi Sun, University of Buffalo, USA
Jie Tang, South China University of Technology, China
Stefano Tomasin, University of Padova, Italy
Le-Nam Tran, Maynooth University, Ireland
Miaowen Wen, South China University of Technology, China
Haijun Zhang, University of Science and Technology, China
Heng Zhang, Western Sydney University, Australia
Qi Zhang, Department of Engineering, Aarhus University, Denmark